Electromigration lifetimes and void growth at low cumulative failure probability

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چکیده

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Electromigration lifetimes and void growth at low cumulative failure probability

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ژورنال

عنوان ژورنال: Microelectronics Reliability

سال: 2006

ISSN: 0026-2714

DOI: 10.1016/j.microrel.2006.08.001